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3D Integration & Advanced Packaging Expert

ASMLManufacturing
Work mode
On-site
Full Time
Location
Experience
5+ yrs
Bachelor's

What you need

  • 5+ yrs process integration engineering in advanced packaging
  • Bachelor's degree in technical field or equivalent experience
  • Strong understanding of semiconductor manufacturing process flows and 3D integration technologies
  • Broad understanding of advanced packaging technology trends and customer roadmaps
  • Ability to translate customer challenges into product development priorities

What you'll do

  • Provide deep expertise in advanced packaging, 3D IC, hybrid bonding
  • Review system design and requirements against customer product requirements
  • Support product strategy, business development, roadmap planning
  • Define and lead customer validation plans to demonstrate value
  • Share knowledge of advanced packaging and 3D integration processes

Key deliverable


  • Build and maintain ASML expertise in Advanced Packaging and 3D Integration technologies.
  • Accelerate ASML 3D product readiness with understanding customer’s tool usability, automation and operational challenges
  • Enhance the team's expertise in Advanced Packaging and strengthen its capabilities to support 3D technologies and applications.
  • Define customer-driven technical requirements, performance targets and use cases, and translate them into ASML product roadmap and development priorities.

Key Activities


  • Provide deep expertise in Advanced Packaging, 3D IC, and Hybrid Bonding technologies
  • Review and feedback system design and requirements w.r.t. customer product requirements
  • Support product strategy, business development, and roadmap planning
  • Define and lead customer validation plans to demonstrate customer value and support business growth.
  • Knowledge sharing of Advanced packaging & 3D integration process

Key qualifications


  • > 5 years process (integration) engineer experience in advanced packaging
  • Bachelor or Master degree in technical subject with substantial experience or equivalent working and thinking level. Optional Business Administration or commercial education. Experience in technical engineering, preferably in the semiconductor industry.
  • Strong understanding of semiconductor manufacturing process flows, 3D Integration technologies, and interactions between process modules.
  • Broad understanding of Advanced Packaging technology trends, customer roadmaps and industry developments.
  • Ability to translate customer technology challenges and application requirements into product development priorities and business value
  • Broad understanding of Advanced Packaging process integration and end-to-end process flows across multiple process modules.
  • Proactive behavior and Logical thinking to solve complex problem or situation.
  • Strong communication and presentation skills in English, with the ability to engage effectively with customers and cross-functional stakeholders
  • Good relationship and network with peers, customers and partners

This position requires access to controlled technology, as defined in the United States Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require ASML to proceed with candidates who are immediately eligible to access controlled technology.


Inclusion and diversity

ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that inclusion and diversity is a driving force in the success of our company.


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About ASML

ASML is the world leader in lithography systems for the semiconductor industry, manufacturing complex machines critical to the production of integrated circuits.

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