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Software engineer, summer intern Singapore
Posted 1 month ago• Software
Compensation
$90,000–$110,000/year
Job Description
Software engineer, summer intern Singapore at Bending Spoons. Department: AI & Engineering. Location: Milan (Italy), or London (UK). Salary: USD 90,000-110,000/year. Seniority: Intern. Skills: Continuous Integration, gRPC, Kubernetes, REST, Continuous Delivery, Python, Full Stack Development, Ideation, Docker, SOA/Microservices, Software Engineer, Intern.
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Job Details
- Category
- Software
- Employment Type
- Internship
- Location
- Milan (Italy), or London (UK)
- Posted
- Feb 19, 2026, 12:49 PM
- Listed
- Apr 5, 2026, 08:52 AM
- Compensation
- $90,000 - $110,000 per year
About Bending Spoons
Part of the growing space & AI ecosystem pushing the frontiers of technology.
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Software engineer, summer intern Singapore
Bending Spoons
