# Advanced Packaging & Integration Lead

**Company:** [Equal1](https://zerogtalent.com/frontier-companies/equal1)
**Location:** Dublin
**Work mode:** Hybrid
**Seniority:** Senior
**Employment type:** Full Time
**Category:** Electrical
**Department:** Other
**Listed:** 2026-09-21

[View and apply on Zero G Talent](https://zerogtalent.com/frontier-jobs/equal1/advanced-packaging-integration-lead-5635575c-92cc-4d08-81ce-7a39035bce23)

## What you'll do

- Drive architectural design of 3D integrated circuits and modules
- Develop packaging solutions using TSVs and flip-chip bonding
- Ensure interconnect reliability through millikelvin thermal cycling
- Develop simulations for signal/power integrity and thermal stress
- Own technical activities with suppliers, OSATs, and partners

## What you need

- 7+ yrs 3D integration and advanced packaging experience
- Master's or PhD in EE or related field
- Expertise with TSVs, micro-bumps, and flip-chip bonding
- Proficiency with Ansys HFSS/Q3D for RF and thermal analysis
- Experience managing technical transfers with external partners

## Job description

We are seeking an experienced Advanced Packaging & Integration Lead to join our team and develop packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system.

In this role, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution.

  

### Main Duties and Responsibilities

-   Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.
    
-   Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
    
-   Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.
    
-   Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.
    
-   Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress.
    
-   Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability.
    
-   Own relevant technical activities with external suppliers, OSATs, and research partners.
    
-   Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines.
    

  

### Experience and Qualifications

**Required**

-   Master’s or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field.
    
-   7+ years’ experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding.
    
-   Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.
    
-   Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.
    
-   Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners.
    
-   Proven ability to guide technical strategy and work effectively across multidisciplinary engineering teams.
    

**Desired**

-   Experience with cryogenic electronics, semiconductor physics, or silicon spin qubits.
    
-   Knowledge of material behaviour at extreme temperatures, including superconductors and low-loss dielectrics.
    
-   Experience leading or mentoring engineers in a high-tech, fast-paced R&D environment.

## Other open roles at Equal1

- [DevOps / Platform Engineer](https://zerogtalent.com/frontier-jobs/equal1/devops-platform-engineer-fe9dd9d3-0fb0-42c1-9a3d-26cdf58e3442) — Timișoara
- [Field Applications Engineer](https://zerogtalent.com/frontier-jobs/equal1/field-applications-engineer-1a373fd7-cce9-4f89-80fe-c92768c46c33) — Dublin
- [Junior Mechanical CAD Engineer / Designer](https://zerogtalent.com/frontier-jobs/equal1/junior-mechanical-cad-engineer-designer-bb0af285-016d-4c11-a9f0-db26cdd71c30) — California
- [Cryogenic Systems Engineer](https://zerogtalent.com/frontier-jobs/equal1/cryogenic-systems-engineer-59104d2e-52d4-458c-be62-42b16fa2a01c) — California
- [Technical Program Manager – Cryomechanical & Quantum System Integration](https://zerogtalent.com/frontier-jobs/equal1/technical-program-manager-cryomechanical-quantum-system-integration-017d7853-b77a-4cbd-8718-ac11d28ebdfe) — California

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