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Software engineer, summer intern Singapore

Compensation
$90,000–$110,000/year

Job Description

Software engineer, summer intern Singapore at Bending Spoons. Department: AI & Engineering. Location: Milan (Italy), or London (UK). Salary: USD 90,000-110,000/year. Seniority: Intern. Skills: Continuous Integration, gRPC, Kubernetes, REST, Continuous Delivery, Python, Full Stack Development, Ideation, Docker, SOA/Microservices, Software Engineer, Intern.

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Job Details

Category
Software
Employment Type
Internship
Location
Milan (Italy), or London (UK)
Posted
Feb 19, 2026, 12:49 PM
Listed
Apr 5, 2026, 08:52 AM
Compensation
$90,000 - $110,000 per year

About Bending Spoons

Part of the growing frontier tech ecosystem pushing the edges of what's possible.

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Software engineer, summer intern Singapore
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